16nm asický čip

Cisco Systems is shipping its first 16nm ASICs in switches that are part of new data center products announced today (Mar. 1). The ASICs leapfrog features offered by Broadcom whose 28nm chips are used in a wide swath of switches made by Cisco and its competitors.

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09.12.2020 16nm asický čip

Huawei Honor 7 ima vgrajen povsem nov Kirin 650 čip z novo FinFET 16nm tehnologijo. Ta ponuja izjemno hitro delovanje. Štiri 2.0 GHz visoko-zmogljiva jedra in štiri 1.7 GHz nižje zmogljiva jedra omogočajo popoln nadzor ter nižjo porabo energijo. Za odlično delovanje zaslona pa skrbi Mali-T830 grafična kartica. Povsem nov Kirin 650 čip z novo FinFET 16nm tehnologijo ponuja izjemno hitro delovanje v primerjavi s prejšnjimi 28nm generacijami procesorjev. Vodilna zasnova procesorja prinaša najboljše iz obeh svetov, ko govorimo o delovanju in zmogljivosti.

4/9/2018

Interface, Ethernet. Temperature, -5 – 35 Такие ASIC часто называют «система на кристалле» (System-on-a-Chip).

10/10/2013

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Interface, Ethernet. Temperature, -5 – 35 Такие ASIC часто называют «система на кристалле» (System-on-a-Chip). 189 чипов, разработанных с применением 16-nm FinFET-технологии. 2017年9月22日 Xavier 採用16nm FinFET 工藝，在提升效能的同時降低功耗，Xavier 運算效能達到 20TOPS，功耗則只需20 瓦。英偉達在智慧汽車領域的客戶

New 16nm FinFET Analog ASIC Integrates Ultrafast Data Converters to Deliver Enormous Cost Savings to High-Volume Designs. SAN JOSE, Calif., Nov. 7, 2017 — (PRNewswire) — MegaChips Corporation today announced a new 16nm FinFET analog ASIC with integrated Gigabit-class data converters designed to meet the cost and performance demands of 5G networks and other high-volume applications. GUC Unveils Its First 16nm IP: Hsinchu, Taiwan, May 22, 2014 - Global Unichip Corp. (GUC), the Flexible ASIC LeaderTM, revealed today that it has successfully silicon proved 16nm DDR4 IP at TSMC, making it one of GUC’s first IP available for TSMC’s 16nm FinFET (16FF) process. The new 16FF DDR4 PHY IP operates at up to 3.2 gigabytes per second (Gbps), a 50 percent increase in speed over MegaChips Unveils Breakthrough 16nm Analog ASIC for 5G and Other High-Speed Applications: MegaChips Corporation today announced a new 16nm FinFET analog ASIC with integrated Gigabit-class data converters designed to meet the cost and performance demands of 5G networks and other high-volume applications. This new analog ASIC breaks through the cost barriers for high-speed … asic & ip AST established in 1986, is the first independent ASIC Design Center in Israel and is one of the first companies in Israel to implement a 7nm, 10nm, 12nm, 16nm, 20nm, 28nm designs. Special emphasis has been given to Bitcoin and Crypto currecy ASIC designs, HPC / Machine Learning / AI / VR projects, Mixed Signal including custom analog Cortus.

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Key ASIC Design Business Unit - offers a wide variety of design services ranging from specification to chip production on 0.18u to 16nm technologies and the design, development and manufacturing of the SoC, board and system including OS, application software, Cloud and APP.

The new 16FF DDR4 PHY IP operates at up to 3.2 gigabytes per second (Gbps), a 50 percent increase in speed over Plymouth, UK -- November 29, 2018-- Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Shenzhen MicroBT Electronics Technology Co., Ltd. have employed Moortec’s 16FFC Temperature Sensor IP in their latest high performance computing (HPC) ASIC.. HPC is highly intensive in terms of CPU activity and requires ever increasing levels of computing power. 11/7/2017 11/22/2017 Temperature Sensor IP in their latest high performance computing (HPC) ASIC. Moortec Semiconductor Ltd, 7 Research Way, Plymouth Science Park, Plymouth, Devon, PL6 8BT www.moortec.com email: info@moortec.com Tel: +44 1752 875 130 MicroBT employs Moortec’s 16nm Embedded Temperature Sensor in their HPC ASIC MicroBT Employs Moortec’s 16nm Embedded Temperature Sensor In Their HPC ASIC: December 02, 2018 -- Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Shenzhen MicroBT Electronics Technology Co., Ltd. have employed Moortec’s 16FFC Temperature Sensor IP in their latest high performance computing (HPC) ASIC. PLDA, the industry leader in PCI Express® IP solutions and MegaChips, a global semiconductor company specializing in ASIC Solution Services, today announced their collaboration to design a combined PCIe Controller IP and PHY IP solution.